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发布日期:2021年04月19日
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Semiconductor Packaging

JCET offers a full suite of assembly services to meet our customers’ semiconductor packaging needs, including leadframe, laminate, flip chip interconnect and advanced wafer level technology. 

JCET differentiates itself by providing a comprehensive platform of wafer level technology that includes Fan-in Wafer Level Packaging (FIWLP), Fan-out Wafer Level Packaging (FOWLP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV) to meet the increasing market demand for next generation devices with higher levels of integration, increased functionality and compact sizes. 

We collaborate with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. Our comprehensive wafer level technology platform provides customers with a wide range of choices for 2.5D and 3D package integration in advanced mobile devices such as smartphones and tablets. 

Package Families 

  • Discrete 分立器件
  • 交换的一天6天狼影院交换的一天6天狼影院,夹住樱桃不准掉回来我检查夹住樱桃不准掉回来我检查
联系我们 |  客户查询 |  法律声明

联系我们 客户查询 法律声明

版权所有@江苏长电科技股份有限公司 保留一切权利 苏ICP备05082751号-132028102000607
版权所有@江苏长电科技股份有限公司
保留一切权利
32028102000607